Work

Overlay challenges in 3D heterogeneous integration

Year: 2022

Type: conference-paper

Source: Metrology, Inspection, and Process Control XXXVI

DOI: 10.1117/12.2608319

Authors: Yoav Grauer, Andy Miller, Douglas Charles La Tulipe, Amnon Manassen, Shlomo Eisenbach, Ohad Bachar, Roel Gronheid

Institutions: KLA (Israel), IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4281556751

FWCI: 3.235

Cites:

Cited by: 10

Related to: 10