Work

Effect of Discharge Power in a Plasma during Reactive-Ion Etching of Massive Substrates on the Matching of the Lower Electrode with a High-Frequency Bias Generator

Year: 2022

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s1063739722030106

Author: S. D. Poletayev

Institutions: Russian Academy of Sciences, Image Processing Systems Institute, Federal Scientific Research Centre Crystallography and Photonics

Language: English

Topic: Low-Pressure Plasma Processing and Diagnostics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4281677142

FWCI:

Cites: 6

Cited by:

Related to: 10