Work

Warpage and Stress Simulation Analysis of Substrate on Substrate Antenna in Package (AiP) for 5G CPE Application

Year: 2022

Type: conference-paper

Source: International Conference on Electronics Packaging (ICEP)

DOI: 10.23919/icep55381.2022.9795386

Authors: Ken Zhang, Vito Lin, David Lai, Yu-Po Wang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4283076342

FWCI: 0.777

Cites: 1

Cited by: 3

Related to: 10