Work

Characteristic Analysis of a Multi-chip Embedded Interposer Carrier using a Wafer-Level Fan-Out Process

Year: 2022

Type: conference-paper

Source: International Conference on Electronics Packaging (ICEP)

DOI: 10.23919/icep55381.2022.9795583

Authors: Ching Kuan Lee, Wen-Hung Liu, Shu-Yi Chang, Ren-Shin Cheng, Yu-Min Lin, Hsiang-En Ding, Wei-Lan Chiu, Tao-Chih Chang, Chia-Hsin Lee, Chang-Chun Lee

Institutions: National Yang Ming Chiao Tung University, National Tsing Hua University, Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Ministry of Economic Affairs

OpenAlex ID: W4283076752

FWCI:

Cites: 4

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Related to: 10