Work

Thiourea modified low molecular polyamide as a novel room temperature curing agent for epoxy resin

Year: 2022

Type: article

Abstract: The thiourea modified low molecular polyamide has low viscosity and high amine value.

Source: RSC Advances

DOI: 10.1039/d2ra02693g

Authors: Zhiyong Huang, Huixin Zhu, Guofeng Jin, Yuanzheng Huang, Minna Gao

Institution: Xi'an High Tech University

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $1,042

Funder: Natural Science Foundation of Shaanxi Province

Award: G5434991583

OpenAlex ID: W4284975813

FWCI: 0.666

Cites: 29

Cited by: 9

Related to: 10