Work

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

Year: 2022

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51906.2022.00009

Authors: X. Sun, J. Slabbekoorn, S. Sinha, P. Bex, N. Pinho, T. Webers, D. Velenis, A. Miller, N. Collaert, G. Van der Plas, E. Beyne

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4285047925

FWCI: 3.923

Cites: 8

Cited by: 13

Related to: 10