Work

QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms

Year: 2022

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51906.2022.00120

Authors: E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont

Institutions: IRT Saint Exupéry, Université de Bordeaux, Laboratoire de l'Intégration du Matériau au Système

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4285103255

FWCI: 1.961

Cites: 17

Cited by: 5

Related to: 10