Work

A 1596-GB/s 48-Gb Stacked Embedded DRAM 384-Core SoC With Hybrid Bonding Integration

Year: 2022

Type: article

Source: IEEE Solid-State Circuits Letters

DOI: 10.1109/lssc.2022.3171862

Authors: Xiping Jiang, Fengguo Zuo, Song Wang, Xiaofeng Zhou, Yubing Wang, Qi Liu, Qiwei Ren, Ming Liu

Institutions: Chinese Academy of Sciences, Institute of Microelectronics, Xi'an UniIC Semiconductors (China), University of Chinese Academy of Sciences, University of Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G4027129818

OpenAlex ID: W4285217154

FWCI: 0.817

Cites: 9

Cited by: 13

Related to: 10