Work

Utilization of an α,β-Unsaturated Carboxylic Acid to Employ an “over Cutting” Mechanism for Defect Mitigation during Cu Post-Chemical Mechanical Planarization (p-CMP) Cleaning

Year: 2022

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2022-01552280mtgabs

Authors: Abigail L. Dudek, Kiana A. Cahue, Jason J. Keleher

Institution: Lewis University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4285397447

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