Work

Heat-tolerant 112-Gb/s PAM4 transmission using active optical package substrate for silicon photonics co-packaging

Year: 2021

Type: conference-paper

Source: Opto-Electronics and Communications Conference (OECC)

DOI: 10.1364/oecc.2021.w3c.4

Authors: S. Suda, T. Kurosu, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, K. Takemura, D. Shimura, Y. Onawa, H. Yaegashi, T. Aoki, T. Amano

Institutions: Photonics Electronics Technology Research Association, National Institute of Advanced Industrial Science and Technology

Language: English

Topic: Photonic and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4287740447

FWCI: 1.156

Cites: 2

Cited by: 4

Related to: 10