Year: 2019
Type: article
Abstract: Package sawing process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units.
Authors: Soreda, Alvin S., Antilano, Ernesto T.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4288029637