Work

A Multi-parameter Condition Monitoring Method for IGBT Bond Wire

Year: 2022

Type: conference-paper

Source: IEEE International Electrical and Energy Conference (CIEEC)

DOI: 10.1109/cieec54735.2022.9846186

Authors: Yangbo Li, Haodong Fu, Qi Li, Chunming Tu, Biao Xiao, Fan Xiao, Ping Liu, Bing Gao, Jiwu Lu

Institution: Hunan University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4290973026

FWCI: 0.777

Cites: 10

Cited by: 2

Related to: 10