Work

Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique

Year: 2022

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2022.3209740

Authors: Zheng Zhang, Chuantong Chen, Aiji Suetake, Hiroshi Ishino, Hirokazu Sampei, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

Institutions: The University of Osaka, Mirise Technologies Corporation (Japan)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4297095620

FWCI: 1.22

Cites: 38

Cited by: 21

Related to: 10