Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability
Year: 2022
Type: article
Source: Microelectronics Reliability
Authors: Zheng Zhang, Ming-Chun Hsieh, Ran Liu, Jeyun Yeom, Aiji Suetake, Hiroshi Yoshida, Chuantong Chen, Joonhaeng Kang, Hidekazu Honma, Yuhei Kitahara, Takashi Matsunami, Kuniaki Otsuka, Katsuaki Suganuma
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G3633360255
OpenAlex ID: W4297200765