Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure
Year: 2022
Type: article
Source: Materials Letters
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: 三维电子封装聚合物绝缘膜共价接枝双向互连方法研究, G862042367
OpenAlex ID: W4308980552
