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Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure

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Year: 2022
Type: article
Source: Materials Letters
DOI: 10.1016/j.matlet.2022.133501
Authors: Liping Chen, Shuhui Chen, Peixin Chen, Liang Cao, Ming Li, Tao Hang
Institutions: Shanghai Jiao Tong University, State Key Laboratory of Metal Matrix Composites
Language: English

Topic: Electronic Packaging and Soldering Technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Shanghai Jiao Tong University
Awards: 三维电子封装聚合物绝缘膜共价接枝双向互连方法研究, G862042367
OpenAlex ID: W4308980552
FWCI: 0.272
Cites: 13
Cited by: 4
Related to: 10
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