Work

Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration

Year: 2022

Type: conference-paper

Source: Electronic System-Integration Technology Conference (ESTC)

DOI: 10.1109/estc55720.2022.9939411

Authors: Steffen Bickel, Iuliana Panchenko, M. Jurgen Wolf

Institutions: Fraunhofer Institute for Reliability and Microintegration, All Silicon System Integration Dresden, Technische Universität Dresden

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4312376260

FWCI: 1.166

Cites: 27

Cited by: 3

Related to: 10