Work

A review on copper chemical vapour deposition

Year: 2023

Type: article

Source: Materials Today Proceedings

DOI: 10.1016/j.matpr.2022.12.140

Authors: Santosh Walke, Manoj B. Mandake, Makarand Naniwadekar, Ravi W. Tapre, Tanmay Ghosh, Yaser Qureshi

Institutions: Bharati Vidyapeeth (Deemed to be University), National University of Science and Technology, Savitribai Phule Pune University, Dinabandhu Andrews College

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4313678564

FWCI: 0.663

Cites: 15

Cited by: 11

Related to: 10