Work

Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board

Year: 2022

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc56328.2022.10013228

Authors: Y. S. Zou, M. H. Chung, C. L. Gan, Jeremy Chen, Claire Hsu, Hem Takiar

Institution: Micron (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4317242524

FWCI: 0.777

Cites: 1

Cited by: 2

Related to: 10