Work

Study on Substrate Crack through Experiment and Simulation on SSD BGA under Temperature Cycling

Year: 2022

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc56328.2022.10013153

Authors: Wei Yu, Faxing Che, Yeow Chon Ong, Hong Wan Ng

Institution: Micron (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4317242529

FWCI: 2.331

Cites: 5

Cited by: 6

Related to: 10