Work

Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit

Year: 2023

Type: article

Source: IETE Journal of Research

DOI: 10.1080/03772063.2023.2177201

Authors: Gulafsha Bhatti, Takshashila Pathade, Yash Agrawal, Vinay Palaparthy, Bakul Gohel, Rutu Parekh, Mekala Girish Kumar

Institution: Dhirubhai Ambani University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4322201493

FWCI: 0.301

Cites: 32

Cited by: 5

Related to: 10