Work

Reactive bonding of SiC and Cu using Cu-Mn liquid insert alloy. Reactive bonding of ceramics and metals (report 1)

Year: 1990

Type: article

Source: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Authors: 邦夫宮崎, 幸夫大越, 斉鈴木

Language: English

Topic: Advanced Welding Techniques Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W433732456

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