Work

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Year: 2015

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2015.05.009

Authors: Kyoung-Moo Harr, Sun-Chul Kim, Young-Min Kim, Young-Ho Kim

Institution: Hanyang University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W435236384

FWCI: 0.699

Cites: 20

Cited by: 9

Related to: 10