Work

Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method

Year: 2023

Type: article

Source: Engineering Fracture Mechanics

DOI: 10.1016/j.engfracmech.2023.109260

Authors: Kai Yang, Longzao Zhou, Fengshun Wu, Guang Yang, Liguo Ding, Kewei Li, Xuemin Li

Institution: Huazhong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G330560727

OpenAlex ID: W4364375006

FWCI: 1.639

Cites: 47

Cited by: 23

Related to: 10