Work

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Year: 2023

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime56861.2023.10100800

Authors: M. Weninger, J. Zündel, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst

Institutions: AT&S (Austria), Polymer Competence Center Leoben (Austria)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4366139713

FWCI: 2.711

Cites: 6

Cited by: 6

Related to: 10