Work

Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks

Year: 2023

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime56861.2023.10100776

Authors: Mariia Shevchuk, Christian Schipfer, Matthias Haselmann, Qi Tao, Peter Fuchs

Institution: Polymer Competence Center Leoben (Austria)

Language: English

Topic: Composite Material Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4366139997

FWCI: 13.32

Cites: 16

Cited by: 11

Related to: 10