Work

Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly

Year: 2023

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime56861.2023.10100850

Authors: Aniket Bharamgonda, Abhijit Dasgupta, Abhishek Deshpande, Torsten Hauck, Yaxiong Chen

Institutions: University of Maryland, College Park, NXP (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4366140253

FWCI: 1.808

Cites: 9

Cited by: 4

Related to: 10