Work

Warpage of Fan-Out Panel Level Packaging – Experimental and Numerical Study of Geometry and Process Influence

Year: 2023

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime56861.2023.10100849

Authors: Andreas Stegmaier, Ole Hölck, Marius van Dijk, Hans Walter, Olaf Wittler, Martin Schneider-Ramelow

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4366140304

FWCI: 1.356

Cites: 11

Cited by: 3

Related to: 10