Work

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Year: 2023

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4062344

Authors: Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu

Institution: University of Electronic Science and Technology of China

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4366189208

FWCI: 0.67

Cites: 12

Cited by: 9

Related to: 10