Work

Advanced overlay metrology for 3D NAND bonding applications

Year: 2023

Type: conference-paper

Source: Metrology, Inspection, and Process Control XXXVI

DOI: 10.1117/12.2660026

Authors: Yoav Grauer, Shlomo Eisenbach, Motti Penia, Dror Elka, Arkady Simkin, Avner Safrani, Efi Megged

Institution: KLA (Israel)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4366254122

FWCI: 1.471

Cites:

Cited by: 3

Related to: 10