Work

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Year: 2023

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4062403

Authors: Jimil M. Shah, Thomas Crandall, Phillip E. Tuma

Institution: 3M (United States)

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4367052017

FWCI: 0.764

Cites: 9

Cited by: 8

Related to: 10