Work

Advanced Flip Chip Packaging

Year: 2023

Type: book-chapter

Source: Springer series in reliability engineering

DOI: 10.1007/978-3-031-26708-6_4

Authors: Chong Leong, Gan, Chen-Yu, Huang

Institution: Micron (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4367359241

FWCI: 17.34

Cites: 52

Cited by: 24

Related to: 10