Work

Development of 3-layer stacked global shutter CMOS image sensor with pixel pitch Cu-to-Cu interconnection and high-capacity capacitors

Year: 2023

Type: conference-paper

Source: IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference (IITC/MAM)

DOI: 10.1109/iitc/mam57687.2023.10154780

Authors: Seungjae Oh, Doowon Kwon, Haejung Lee, Kyungtae Lim, Taeyeong Kim, Jae-Hyung Park, Kyuha Lee, Hyo Ju Kim, Yoonjay Han, Jae-Kyu Lee, Chang-Rok Moon, Jaihyuk Song

Institution: Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4381745549

FWCI: 5.423

Cites:

Cited by: 12

Related to: 10