Effects of pH on the Immersion Gold Process from a Sulfite-Thiosulfate Solution Based on the Electroless Ni-P Alloy Substrate
Year: 2015
Type: article
Abstract: The immersion gold process from a sulfite-thiosulfate solution based on electroless Ni-P alloy substrate with 9% P content was investigated by X-ray fluorescence spectrometer, atomic force microscopy and open circuit potential measurement. The effects of pH on the gold deposition process were also discussed. The results show that the deposition rate and open circuit potential are changed during the immersion gold process. In the range of pH (6-9), a high pH results in a positive electrode potential, a slow deposition rate, and a better surface morphology of the gold coating with a smaller surface roughness.
Institutions: Harbin Institute of Technology, Qingdao University
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,670
OpenAlex ID: W4382398828