Work

Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon Carrier

Year: 2023

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2023.3293528

Authors: J.-C. Souriau, C. Poulain, L. Castagné, C. Ladner, T. Hilt, R. Franiatte, D. Mermin, N. David

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes, Soitec (France)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Centre National de la Recherche Scientifique

OpenAlex ID: W4383753012

FWCI: 0.521

Cites: 12

Cited by: 7

Related to: 10