Work

Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations

Year: 2023

Type: conference-paper

Source: IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice (ICSE-SEIP)

DOI: 10.1109/icse-seip58684.2023.00037

Authors: Ming Yan, Junjie Chen, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui

Institutions: Tianjin University, Huawei Technologies (China)

Language: English

Topic: Software Testing and Debugging Techniques

Subfield: Software

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4383898409

FWCI: 1.062

Cites: 71

Cited by: 6

Related to: 10