Work

Development of nano filler reinforced semi-solid rapid curing sealant paste for through-thickness leaking defect repair in pipelines

Year: 2023

Type: article

Source: Journal of Adhesion Science and Technology

DOI: 10.1080/01694243.2023.2242168

Authors: Vishwas Chandra K., Vikas Sharma B. S., Nitheesh Kumar P., Balaganesan G., Jayakumar K., Puneet Mahajan

Institutions: Indian Institute of Technology Delhi, Indian Institute of Technology Madras, Vikram Sarabhai Space Centre

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4385503141

FWCI: 0.157

Cites: 23

Cited by: 2

Related to: 10