Work

Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance

Year: 2023

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51909.2023.00112

Authors: Tamira Stegmann, André Schwöbel, Wolfgang Schmitt, Stefan Gunst, Karsten Durst, Peter Klar, Nils Neugebauer, Jan Luka Dornseifer

Institutions: Heraeus (Germany), Technische Universität Darmstadt, Justus-Liebig-Universität Gießen

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: European Regional Development Fund

OpenAlex ID: W4385525482

FWCI: 1.808

Cites: 11

Cited by: 4

Related to: 10