Work

Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

Year: 2023

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51909.2023.00121

Authors: Ip Nathan, Nima Nejadsadeghi, Norifumi Kohama, Hayato Tanoue, Kimio Motoda

Institutions: Tokyo Electron (Japan), Tokyo Electron Kyushu Ltd (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4385541908

FWCI: 10.85

Cites: 9

Cited by: 24

Related to: 10