Work

Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)

Year: 2023

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51909.2023.00092

Authors: Hyunju Lee, Sung Keun Park, Kwangok Jeong, Jaemok Jung, Ju-il Choi, Un-Byoung Kang, Kuyoung Kim

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4385541989

FWCI: 2.689

Cites: 5

Cited by: 6

Related to: 10