Work

TSV filling with copper electro-deposition by using phenyl disulfide propane sodium

Year: 2023

Type: conference-paper

Source: International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE)

DOI: 10.1117/12.3004800

Author: Yuping Le

Institution: Shanghai Technical Institute of Electronics & Information

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4385877341

FWCI:

Cites: 17

Cited by:

Related to: 10