Work

A Low-Cost Antenna-in-Package (AiP) for D-Band Application

Year: 2023

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51909.2023.00086

Authors: Hung-Chun Kuo, Po-I Wu, Ming-Fong Jhong, Sheng-Chi Hsieh, Chen-Chao Wang

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Antenna Design and Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4385900973

FWCI: 2.26

Cites: 15

Cited by: 5

Related to: 10