Work

Exploring Advanced Packaging Technologies for Reverse Engineering a System-in-Package (SiP)

Year: 2023

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2023.3311801

Authors: M. Shafkat M. Khan, Chengjie Xi, Md Saad Ul Haque, Mark M. Tehranipoor, Navid Asadizanjani

Institution: University of Florida

Language: English

Topic: Physical Unclonable Functions (PUFs) and Hardware Security

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Office of Naval Research

OpenAlex ID: W4386432026

FWCI: 6.809

Cites: 24

Cited by: 39

Related to: 10