Work

Dual-Band Antenna-in-Package (AiP) Front-End Module for 5G mmWave Mobile Device Applications

Year: 2023

Type: conference-paper

Source: Digest - IEEE Antennas and Propagation Society. International Symposium

DOI: 10.1109/usnc-ursi52151.2023.10238193

Authors: Gyoungdeuk Kim, Dohyun Kim, Sangkil Kim, Kyungho Lim, Chanwoo Yang, Chisang You

Institutions: Pusan National University, LG (South Korea)

Language: English

Topic: Antenna Design and Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4386495080

FWCI: 0.896

Cites: 3

Cited by: 2

Related to: 10