Work

A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers

Year: 2023

Type: article

Source: Applied Thermal Engineering

DOI: 10.1016/j.applthermaleng.2023.121667

Authors: Praveen Dhanalakota, Hemanth Dileep, Laxman Kumar Malla, Pallab Sinha Mahapatra, Arvind Pattamatta

Institution: Indian Institute of Technology Madras

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funders: Department of Science and Technology, Ministry of Science and Technology, India, Science and Engineering Research Board

Award: G3864861676

OpenAlex ID: W4386945889

FWCI: 2.864

Cites: 29

Cited by: 30

Related to: 10