Work

Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method

Year: 2023

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2023.115235

Authors: Na-Yeon Choi, Sung-Uk Zhang

Institution: Dong-Eui University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4387207366

FWCI: 0.214

Cites: 28

Cited by: 3

Related to: 10