Work

Experimental Comparison on Thermal Performance of Pulsating Heat Pipe and Embedded Heat Pipe Heat Spreaders

Year: 2023

Type: conference-paper

Source: Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings

DOI: 10.23919/semi-therm59981.2023.10267897

Authors: Sai Kiran Hota, Kuan-Lin Lee, Greg Hoeschele, Richard Bonner, Srujan Rokkam

Institution: Advanced Cooling Technologies (United States)

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Small Business Innovation Research

OpenAlex ID: W4387329026

FWCI: 2.442

Cites: 6

Cited by: 3

Related to: 10