Work

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Year: 2023

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2023-111725

Authors: Mahdi Farahikia, Ping-Chuan Wang

Institution: SUNY New Paltz

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4389044697

FWCI: 0.802

Cites:

Cited by: 1

Related to: 10