Improving Manifold Microchannel Heat Sink Cooling Performance and Thermal Uniformity by Changing the Fins Below the Manifold Channel
Year: 2023
Type: preprint
Source: SSRN Electronic Journal
DOI: 10.2139/ssrn.4660885
Authors: Xiaojun Pu, Zhongchao Zhao, Yeqi Huang, Jiahui Ding, Xiaofei Liu
Institution: Jiangsu University of Science and Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4389549331