Work

Micro-Defect Failure Analysis in Fan-Out Package and Correspond to Finite Element Method (FEM) Simulation Results

Year: 2023

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact59481.2023.10348782

Authors: Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin, Wei-Jie Yin

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4390100807

FWCI:

Cites: 3

Cited by:

Related to: 10