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Modeling of Thermoelectric Modules with Thermal Stress Damping for Transport Electrical Equipment

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Year: 2023
Type: conference-paper
Source: IEEE International Conference on Modern Electrical and Energy System (MEES)
DOI: 10.1109/mees61502.2023.10402432
Authors: Oleksandr Kyrychenko, Svitlana Golubieva, Maryna Morneva
Institutions: State University of Infrastructure and Technologies, Volodymyr Dahl East Ukrainian National University
Language: English

Topic: Advanced Thermoelectric Materials and Devices
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed
OpenAlex ID: W4391306703
FWCI: 11.27
Cites: 6
Cited by: 10
Related to: 10
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